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eLibrary > BS IEC 63055:2023, IEEE Std 2401™-2019 Format for LSI-Package-Board Interoperable design >

BS IEC 63055:2023, IEEE Std 2401™-2019 Format for LSI-Package-Board Interoperable design, 2023

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Contents
FOREWORD
Title page
IEEE Introduction
1. Overview [Go to Page]
1.1 Scope
1.2 Purpose
1.3 Key characteristics of the LSI-Package-Board Format
1.4 Contents of this standard
1.5 Word usage
2. Normative references
3. Definitions, acronyms, and abbreviations [Go to Page]
3.1 Definitions
3.2 Acronyms and abbreviations
4. Concept of the LPB Format [Go to Page]
4.1 Technical background
4.2 Conventional design
4.3 Common problems at the design site
4.4 Concept of LPB interoperable design
4.5 Value creation by LPB interoperable design
4.6 LPB Format
4.7 Summary of LPB Format files
5. Language basics [Go to Page]
5.1 General
5.2 Typographic and syntax conventions
5.3 Character information
5.4 Notation of the floating point number
5.5 File naming definitions
6. Common elements in M-Format, C-Format, and R-Format [Go to Page]
6.1 General
6.2 The element
6.3 The
element
6.4 The element
7. M-Format [Go to Page]
7.1 M-Format file structure
7.2 The element
7.3 The element
7.4 The element
8. C-Format [Go to Page]
8.1 C-Format file structure
8.2 The element
8.3 The element
9. R-Format [Go to Page]
9.1 R-Format file structure
9.2 The element
9.3 The element
10. N-Format [Go to Page]
10.1 Purpose of the N-Format file
10.2 How to identify the power/ground network
10.3 Example
11. G-Format [Go to Page]
11.1 Language basics of G-Format
11.2 Structure
11.3 Header section
11.4 Material section
11.5 Layer section
11.6 Shape section
11.7 Board geometry section
11.8 Padstack section
11.9 Part section
11.10 Component section
11.11 Net attribute section
11.12 Netlist section
11.13 Via section
11.14 Bondwire section
11.15 Route section
Annex A (informative) Bibliography
Annex B (informative) Examples of utilization [Go to Page]
B.1 Understanding the function of the LPB Format
B.2 Test bench
B.3 Design flow example
B.4 Growth of the sample files in the LPB Format
B.5 Simulations using the sample files in the LPB Format
Annex C (informative) XML Encryption
Annex D (informative) MD5 checksum
Annex E (informative) Chip-Package Interface Protocol [Go to Page]
E.1 General
E.2 Comparison of C-Format with Chip-Package Interface Protocol
Annex F (informative) M-Format usage examples [Go to Page]
F.1 General
F.2 Bundling files for a product
F.3 Bundling files for a library
F.4 Managing design versions using M-Format
Annex G (informative) Example of how to express the connector parts as terminals [Go to Page]
G.1 General [Go to Page]

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